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Thermally Conductive Gap Filler

Summary: Thermal gap filling material is a medium used for the position of the chip heat source to conduct heat. Because the material itself has good compliance and thermal conductivity, it can fully contact the surface of the chip heat source, and the heat source and metal surface are uneven.
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产品描述

Thermal gap filling material is a medium used for the position of the chip heat source to conduct heat. Because the material itself has good compliance and thermal conductivity, it can fully contact the surface of the chip heat source, and the heat source and metal surface are uneven. The air is fully exhausted to ensure that the heat is conducted to the metal shell or diffuser plate in a timely and efficient manner, thereby improving the efficiency and service life of the heating electronic components

 

Model: Thermal Conductivity: Thickness:

T-FX150 1.5W/m*k 0.25mm~20mm

T-FX200 2.0W/m*k 0.25mm~20mm

T-FX300 3.0W/m*k 0.25mm~20mm

T-FX450 4.5W/m*k 0.3mm~5mm

T-FX500 5.0W/m*k 0.3mm~5mm

T-FX600 6.0W/m*k 0.3mm~5mm

T-FX800 8.0W/m*k 0.5mm~5mm

T-FX1000 10 W/m*k 0.5mm~5mm

T-FX1200 12 W/m*k 0.5mm~5mm

T-FX1500 15 W/m*k 0.5mm~5mm

T-FX2000 20 W/m*k 0.5mm~5mm

T-FX2500 25 W/m*k 0.5mm~5mm
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Application: device heating module

Product thickness and thermal conductivity can be flexibly customized

Keyword:
Thermally Conductive Gap Filler
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